The company will be signing 16 agreements at the Semicon India conference
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BHAWIKA CHHABRA
Tata Electronics has signed the maximum memoranda of understandings (MoUs) on the sidelines of Semicon India 2026, and the company has also announced setting up of a 363 acre Vendor Park for its suppliers in Dholera, Gujarat.
In Dholera, the company has brought together more than 450 ecosystem partners to build the fab, spanning construction, equipment, chemicals and material partnerships. The vendors can acquire land in this Vendor Park and it will have a plug-and-play infrastructure in terms of power, utility, roads, etc., the company informed.
The company will be signing 16 agreements at the Semicon India conference with players across Europe, Japan, Singapore, and India, CEO Randhir Thakur said. He said the company’s fab in Dholera, and the packaging facility in Assam are “on track” to meet scheduled commitments made to the government.
“Five years ago, India Semiconductor Mission was formed. Today, there are 12 factories which are under different stages of completion, and we are already exporting Made in India chips to customers globally,” Thakur said.
‘Perfect sync’
The government is “in perfect sync with the semiconductor industry”, he said adding that in just 12 years, India’s electronics industry has grown from ₹2 lakh crore in 2014 to over ₹13 lakh crore in 2026.
Mentioning about the agreements, he said, “There are companies like Nexperia and BESI from Europe, JSR, Fujifilm, Sumitomo…from Japan, Kelington from Malaysia, Ascendas First Space from Singapore, L&T Semiconductors, Inox Air Products, and Gati Shakti Vishwavidyalaya from India, and other partners from the US, Europe, and India, all specialising in different parts of the semiconductor value chain.”
Tata Electronics has created over 1.50 lakh direct jobs, he said adding that each semiconductor job creates 10 jobs in the ecosystem, and there are thousands of ecosystem jobs being created by Tata Electronics and the company has 65 per cent women in its workforce.
Published on September 17, 2026
